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  • 1700V IGBT Module Employs Non-Epitaxial PT chips, Low Inductance Package

    1700V IGBT Module Employs Non-Epitaxial PT chips, Low Inductance Package

    While punch throughs (PTs) are the preferred power device for a growing segment of industrial power conversion applications requiring operation from ac line voltages of 575Vac to 690Vac, historically, 1700V IGBTs based on a non punch through (NPT) structure were popular. For the NPT device to have stable leakage current at such high bl...

  • Solderable and Sinterable Top Side Bonding for High Power IGBT Wafers

    Solderable and Sinterable Top Side Bonding for High Power IGBT Wafers

    IXYS Corporation has introduced solderable or sinterable top side on 200 and 300 Amps,  650 Volt Trench XPTTM IGBT silicon dies. The top side solderable metallization improves the power cycling capabilities of power modules. Replacing the standard bond wire connections by using the standard soldering process improves the power cycli...

  • IGBT Intelligent Power Modules

    IGBT Intelligent Power Modules

    Microsemi Corporation announced a line of intelligent half bridge Insulated Gate Bipolar Transistor (IGBT) standard power modules, including five products that simplify system design and are each available in the company's proprietary low-profile LP8 package. Microsemi's intelligent power modules are targeted at applications ranging...

  • 6th Generation Mega Power Dual IGBT Modules

    6th Generation Mega Power Dual IGBT Modules

    Mitsubishi Electric is introducing its 6th generation Mega Power Dual (MPD) Insulated Gate Bipolar Transistor (IGBT) modules. The modules, which are for use in power converters such as large-capacity photovoltaic and wind power generation systems, are also suitable for other high-power applications e.g. in the areas of Uninterruptible ...

  • PowerSim IGBT Modules

    PowerSim IGBT Modules

    Powerex, Inc. recently added several new NX-Series IGBT modules to its PowerSim app: CM200DX-34SA CM600DXL-34SA CM225DX-24S1 CM300DX-24S1 CM450DX-24S1 CM600DX-24S1 Parts ending in S1 denote the 6.1 Generation NX-Series IGBT product line, incorporating the 6.1 (Carrier Stored Trench Bipolar Transistor) CSTBT™ silicon, facilitating a ...

  • Acoustic Imaging Of IGBT Modules Through The Heat Sink

    Acoustic Imaging Of IGBT Modules Through The Heat Sink

    Acoustic imaging of IGBT modules can spot gap-type defects in or among the materials bonded to create the module. IGBT failures are often caused by gap-types defects in or among the materials bonded to create the module. The defects may be voids, delaminations, disbonds, or may involve the tilting of a layer, typically the ceram...

  • Optically-isolated voltage sensors-The ACPL-C87x

    Optically-isolated voltage sensors-The ACPL-C87x

    [caption id="attachment_646" align="alignnone" width="250"] Voltage sensor-ACPL-C87x[/caption] Avago Technology presents a new category of optically-isolated current devices, which can be eye remoteness built-in amplifiers according to sigma-delta modulation which is particularly enhanced pertaining to voltage realizing. Focused on ...

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